CONTENTS
17.1 Key Challenges for 3D Circuits and Approaches Revised
17.1.1 Technological Challenges
17.1.1.1 Diversity of Integration Approaches
17.1.1.2 Power Delivery and Thermal Management
17.1.2.1 Layout Representations for 3D Circuits
17.1.2.2 Partitioning and Floorplanning
17.1.2.4 Clock-Distribution Networks
17.1.2.5 Routability Prediction
17.1.2.7 Multi-Physical Simulation and Verification
17.2 Prospective Directions for 3D Circuits and Design
17.2.1 Path-Finding: System-Level Design Exploration and ...
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