Chapter 17
Porous Silicon as a Material for Thermoelectric Devices
Androula G. Nassiopoulou
17.1 Introduction
Thermal management is currently one of the key issues in several applications. In nanoelectronics, for example, one of the major limiting factors in complementary metal oxide semiconductor (CMOS) devices and integrated circuits (ICs) scaling down is heat dissipation. Efficient cooling is needed in order to assure electronic chip reliability. Thermoelectric (TE) devices constitute a promising technique to cool ambience or convert wasted thermal energies into useful power. Thermoelectric generators are reliable devices and do not need any special maintenance. Although they have a poor yield, they are already used in different applications, ...
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