Porous Silicon–Based Explosive Devices
Monuko du Plessis
It is relatively easy in today’s silicon semiconductor integrated circuit technology to manufacture more than 1 billion devices onto one single chip. This mature technology has followed the well-known Moore’s law for decades, but further scaling down of device dimensions may require a “more than Moore” rather than “more of Moore” approach (Kent and Prasad 2008). The “more than Moore” approach entails the integration of additional nonelectronic functionality onto the chips. These functionalities may include photonic, mechanical, and microelectromechanical systems (MEMS) devices, as well as biological interfaces, for example, micro fluidic structures. For these ...