It is used by the digital baseband for digital processing and by the
application processor. This can be standard SRAM or PSRAM (Pseudo-SRAM).
Stacked memory: It is a module containing fl ash memory and SRAM in a single
package. Also called MCP (multi-chip package) memory. It is also sometimes
offered with an application processor in-package. Additionally called Package-
on-Package and System-in-Package.
Power management: Power management ICs regulate, control, manipulate,
and optimize the use and delivery of battery power to handset components. In
addition they can provide battery management capabilities ...
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