Thermal Analysis and Design 193
Laying out heatsinking systems for surface mount packaging technology
systems is still an uncertain process. Semiconductor manufacturers still do not
offer adequate information for each power package to feel confident about the
adequacy of the heatsinking design. The graph in Figure A–7 is a normalized
plot based upon a SOT223 package. The curve is 2oz copper on the top of the
PCB only. The curve, such as contained in Figure A–7, are needed to properly
size the PC board heatsink island.
A.6 Examples of Some Thermal Applications
These examples will show the reader a typical application of thermal analysis
but with common ...