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Power Supply Cookbook, 2nd Edition
book

Power Supply Cookbook, 2nd Edition

by Marty Brown
June 2001
Intermediate to advanced content levelIntermediate to advanced
280 pages
10h 38m
English
Newnes
Content preview from Power Supply Cookbook, 2nd Edition
Thermal Analysis and Design 193
Laying out heatsinking systems for surface mount packaging technology
systems is still an uncertain process. Semiconductor manufacturers still do not
offer adequate information for each power package to feel confident about the
adequacy of the heatsinking design. The graph in Figure A–7 is a normalized
plot based upon a SOT223 package. The curve is 2oz copper on the top of the
PCB only. The curve, such as contained in Figure A–7, are needed to properly
size the PC board heatsink island.
A.6 Examples of Some Thermal Applications
These examples will show the reader a typical application of thermal analysis
but with common ...
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Publisher Resources

ISBN: 9780750673297