SINGLE-WAFER INTEGRATED DEVICE PROCESSING

This section presents an overview of various single-wafer fabrication techniques for integrated processing of microelectronic devices. Numerous processing modules, sensors, and associated fabrication processes have been developed for advanced semiconductor device manufacturing. Specific developments and results will be presented in the areas of rapid thermal processing (RTP), dry and vapor-phase surface cleaning, epitaxy, plasma processing, and in situ sensors.

Single-Wafer Semiconductor Manufacturing

The continuing demands for higher chip packing densities and enhanced system-level performance are the main technology and device scaling drivers. The high-performance processor and dense memory chips ...

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