Abstract11.1 Introduction11.2 Overview11.3 Challenges11.4 Modeling11.5 Accelerated life testing (ALT)11.6 ALT example: how to craft a thermal cycling ALT plan for SnAgCu (SAC) solder failure mechanism11.7 How to craft a temperature, humidity, and bias ALT plan for CMOS metallization corrosion11.8 Developments and opportunities11.9 Conclusions11.10 Sources of further information