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RFID Sourcebook by Sandip Lahiri

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B.1. Die

A die consists of an individual tag microchip on a silicon wafer. A silicon wafer is a circular slice of silicon a few inches in diameter (generally 8 inches) on which a significant number of microchips can be produced.

This manufacturing step generally consists of the following substeps:

1.
Produce microchips on the silicon wafer. Chemical etching processes (also known as photolithographic processes) are used to produce several hundred to thousands of tag microchips on the silicon wafer.
2.
Test. The individual microchips on the wafer are tested for functionality. Metal points are generally used in this testing to access the chip directly via its specialized contact fields. The chip is placed in a test mode, in which all its functionalities ...

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