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Separation Process Engineering: Includes Mass Transfer Analysis, Third Edition by Phillip C. Wankat

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10.5 Sieve Tray Layout and Tray Hydraulics

Tray layout is an art with its own rules. This section follows the presentations of Ludwig (1997), Bolles (1963), Fair (1963, 1984, 1985), Kister (1990, 1992, 2008), and Lockett (1986), and more details are available in those sources. The holes on a sieve plate are not scattered randomly on the plate. Instead, a detailed pattern is used to ensure even flow of vapor and liquid on the tray. The punched holes in the tray usually range in diameter from 1/8 to 1.0 inch. In the range from ½ to 1 inch, efficiency is constant and at its highest level. The 1/8-inch holes with the holes punched from the bottom up are often used in vacuum operation to reduce entrainment and minimize pressure drop. In normal operation, ...

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