Signal Integrity: From High Speed to Radiofrequency Applications

2

Electromagnetic Modeling of Interconnects

Electromagnetism is used to determine the behavior of complex interconnects involving a large-band signal corresponding to high-speed applications. Models based on capacitances, inductances or transmission lines are determined in order to predict circuit behavior. The type of model to be used depends on the frequency band being considered, which is linked to signal speed as discussed in Chapter 1.

Depending on frequency, a capacitive, inductive or transmission line model is required to predict interconnect performance.

2.1. Global modeling of signal integrity

The global modeling of signal integrity problems requires taking account of the sources of digital signals and power supplies, as well as the interconnections linking different functions. An understanding of the behavior of each part of an interconnect including the parts that carry power is essential for predicting the signal received. Knowledge of input and output parameters enables us to know the parameters of the propagated signal, particularly its rise time.

2.1.1. ICEM and ICIM models

Integrated circuit emission modeling (ICEM) models have been developed for the behavioral modeling of conducted emission of integrated circuits. Integrated circuit immunity modeling (ICIM) models account for the immunity of integrated circuits. These models are a part of the IEC62433 standard [IEC 02]:

– IEC62433-1: definitions;

– IEC62433-2: modeling of conducted emission (ICEM-CE);

– IEC62433-3: ...