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3D integration of silicon-on-insulator (SOI) integrated circuits (ICs) for improved performance

C.S. Tan,    Nanyang Technological University, Singapore

Abstract:

Three-dimensional integrated circuit, 3D IC, integration is currently being investigated for continuous performance enhancement and functional diversification in future circuits and systems. SOI wafers uniquely allow ultra-thin Si layer transfer and stacking without the need for high aspect ratio TSV, usually needed in bulk Si 3D IC. This platform promises extremely high density of vertical interconnects between the active layers in 3D IC as technology scales. This chapter outlines material and process requirements of SOI-based 3D IC. Generic and customized process flows are presented. ...

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