book

Smart Sensors and MEMS, 2nd Edition

by S Nihtianov, A. Luque

February 2018

Intermediate to advanced

604 pages

20h 37m

English

Woodhead Publishing

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1.1. Introduction1.2. Interpretation of terms related to sensors1.3. Key trends in the development of sensors (sensor devices) and microelectromechanical systems1.4. Suggestions for improving terminology in the field of sensors and microelectromechanical systems1.5. Conclusion
2.1. Introduction2.2. Sensors2.3. Microcontrollers2.4. Interface circuits2.5. Applications2.6. Future trendsSources of further information and advice
3.1. Introduction3.2. Measuring temperature, temperature differences, and temperature changes in industrial applications3.3. Temperature-sensing elements3.4. Basic concepts of smart temperature sensors3.5. Methods to improve the accuracy of CMOS smart temperature-sensor systems3.6. Principles of BJT-based smart temperature sensors with DCM3.7. Signal processing of duty cycle modulated signals3.8. Fabrication and test results3.9. Summary
4.1. Introduction4.2. Challenges for subnanometer displacement measurement with capacitive sensors4.3. Offset capacitance cancellation technique4.4. Capacitance-to-digital converter with offset capacitance cancellation and calibration functions4.5. Conclusion

5.1. Why inductive displacement sensors?5.2. Principle of operation and practical limitations for eddy-current sensors5.3. Design requirements in precision industrial applications5.4. State-of-the-art eddy-current sensor interfaces5.5. Eddy-current sensor interfaces with LC oscillator and ratiometric measurement5.6. Summary and design perspectivesAppendix
6.1. Introduction6.2. Conclusions
7.1. Introductory overview7.2. Challenges for radiation detection in the VUV and EUV spectral ranges7.3. Device solutions for radiation detection in the VUV and EUV spectral ranges7.4. Methods of radiometric investigation and characterization7.5. Spectral responsivity and radiation hardness of VUV and EUV radiation detectors7.6. Future trends
8.1. Introduction8.2. Resistive sensors8.3. Voltamperometric resistance estimation8.4. Resistance-to-time conversion methods8.5. Industrial-related aspects8.6. Conclusion and future trends
9.1. Introduction9.2. Fundamentals of ultrasonic sensing and pulse-echo measurements9.3. Reconfigurable ultrasonic smart sensor platform design9.4. Algorithms used in evaluation of reconfigurable ultrasonic smart sensor platform9.5. Hardware realization of ultrasonic imaging algorithms using reconfigurable ultrasonic smart sensor platform9.6. Future trends9.7. Conclusion9.8. Sources of further information and advice
10.1. Introduction10.2. Displacement interferometers10.3. Sources of error and compensation methods10.4. Optical encoders10.5. Design considerations10.6. Current and future trends10.7. Conclusion
11.1. Introduction11.2. Microelectromechanical systems design and modeling11.3. Materials11.4. Microfabrication processes11.5. Simulation11.6. Conclusion
12.1. Introduction12.2. Considerations in mechanisms selection12.3. Electrostatic systems12.4. Electrothermal systems12.5. Piezoelectric systems12.6. Conclusion
13.1. Introduction13.2. Basics of microfluidics13.3. Components of a microfluidic system13.4. Reaction chambers13.5. Conclusions
14.1. Introduction14.2. Resonant frequency response of smart microelectromechanical systems vibrating structures14.3. Quality factor and the loss coefficient of smart microelectromechanical systems vibrating structures14.4. Industrial applications
15.1. Introduction15.2. Technical description of MEMS motion sensors: MEMS accelerometer15.3. Microelectromechanical systems gyroscope15.4. Microelectromechanical systems magnetometer15.5. Conclusion and future trends
16.1. Introduction16.2. Electrohydrodynamic print head droplet ejection16.3. Electrohydrodynamic smart printing system16.4. Case study: electrohydrodynamic printing applications16.5. Conclusion
17.1. Introduction17.2. Photovoltaic mini-generators17.3. Applications of photovoltaic mini-generators17.4. Microfuel cells17.5. Applications of microfuel cells17.6. Smart energy management with sun sensors17.7. Conclusion
18.1. Introduction18.2. Evolution of RF-MEMS and of market expectations18.3. RF-MEMS in the emerging 5G scenario18.4. RF-MEMS technology: a general overview18.5. RF-MEMS technology for capacitive microdevices18.6. RF-MEMS technology for ohmic microdevices18.7. RF-MEMS-based circuits for smart communication systems18.8. RF-MEMS reliability18.9. RF-MEMS power capability18.10. Cointegration of RF-MEMS-based circuits with integrated circuits18.11. Conclusions
19.1. Introduction19.2. Microelectromechanical systems microphones19.3. Fundamentals of acoustic sensor arrays and applications19.4. Design and implementation of smart acoustic microelectromechanical systems array19.5. System implementation of AMA and CAPTAN19.6. Smart acoustic sensor array system operation19.7. Smart acoustic sensor array system calibration19.8. Sensor array for time-of-flight measurements19.9. 3D sound source localization19.10. Smart acoustic sensor array system for mapping of the heart sound19.11. Conclusion

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