Chapter 1. Introduction

Laung-Terng (L.-T.) WangSynTest Technologies, Inc., Sunnyvale, California

Charles E. StroudAuburn University, Auburn, Alabama

Nur A. ToubaUniversity of Texas, Austin, Texas

About This Chapter

Over the past three decades, we have seen the semiconductor manufacturing technology advance from 4 microns to 45 nanometers. This shrinkage of feature size has made a dramatic impact on design and test. Now we find system-on-chip (SOC) and system-in-package (SIP) designs that embed more than 100 million transistors running at operating frequencies in the gigahertz range. Within this decade, there will be designs containing more than a billion transistors. These designs can include all varieties of digital, analog, mixed-signal, memory, ...

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