Chapter 10. Design for Debug and Diagnosis

T. M. MakIntel Corporation, Santa Clara, California

Srikanth VenkataramanIntel Corporation, Hillsboro, Oregon

About This Chapter

Designers have to be prepared for the scenario where chips do not work as intended or do not meet performance expectations after they are fabricated. Product yield engineers need to know what has caused their product yield to be below expectation. Reliability engineers need to know what circuits or elements have failed from various stresses and which ones customers have returned. It is necessary to debug and diagnose chip failures to find the root cause of these issues, and this is best facilitated if the design has accommodated features for debug and diagnosis.

This chapter focuses ...

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