Understanding Fabless IC Technology

Understanding Fabless IC Technology

by Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya
Released April 2011
Publisher(s): Newnes
ISBN: 9780080551197

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Book description

Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. “Fabless” ICs are those designed and marketed by one company but actually manufactured by another.

*Written by board members of the Fabless Semiconductor Association, an industry consortium that include Xilinx, Intersil, Micro Linear, and many other members
*Approriate for a wide range of integrated circuit (IC) designers and users who need to understand the fabless process and its advantages/limitations
*Discusses important topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control

Table of contents

  1. Front Cover
  2. Understanding Fabless IC Technology
  3. Copyright Page
  4. Contents (1/2)
  5. Contents (2/2)
  6. Acknowledgements
  7. Preface
  8. PART 1 – Manufacturing Strategies: Understanding Fabless IC Technology
    1. Chapter 1: More than a Decade of Transition in the Semiconductor Industry
      1. 1.1 FSA is Established
      2. 1.2 Early Success
      3. 1.3 Early Success Trend Continues
      4. 1.4 Semiconductor Business Models
      5. 1.5 Outsourcing Will Accelerate
      6. 1.6 IDMs are Going Fabless
      7. 1.7 A Case Study: Cypress Semiconductor
      8. 1.8 More IDMs are Outsourcing
      9. 1.9 Geographic Manufacturing Centers
    2. Chapter 2: Fabless Semiconductor Manufacturing
      1. 2.1 Foundry Revenue Growth
      2. 2.2 Semiconductor Back-End Services
      3. 2.3 Semiconductor Equipment
    3. Chapter 3: Qualities of Successful Fabless Companies
      1. 3.1 Defining Events for the Fabless Market
      2. 3.2 Thriving in the Fabless Model
      3. 3.3 Key Qualities for Success
      4. 3.4 The Future of Fabless
  9. PART 2 – An In-Depth Understanding of the Fabless Semiconductor Business Model
    1. Chapter 4: Semiconductor Manufacturing Basics
      1. 4.1 Semiconductor Processes
      2. 4.2 Semiconductor Manufacturing Steps
      3. 4.3 Wafer Size
      4. 4.4 Manufacturing Costs
      5. 4.5 Conclusion
    2. Chapter 5: Fabless ASICs
      1. 5.1 Introduction
      2. 5.2 Origins of the ASIC Industry
      3. 5.3 Emergence of the Fabless ASIC Business Model
      4. 5.4 The Fabless ASIC Model: How It Works
      5. 5.5 The Services and Capabilities of a Fabless ASIC Supplier
      6. 5.6 Conclusion
    3. Chapter 6: Electronic Design Automation
      1. 6.1 Fabless EDA Overview
      2. 6.2 Fabless EDA Selection Process (1/2)
      3. 6.2 Fabless EDA Selection Process (2/2)
      4. 6.3 Physical Design EDA
    4. Chapter 7: Intellectual Property
      1. 7.1 SIP Industry Overview
      2. 7.2 SIP Business Environment
      3. 7.3 Sourcing SIP Products
      4. 7.4 Baseline Terminology
      5. 7.5 Finding SIP and Related Products
      6. 7.6 Evaluating SIP Business Models
      7. 7.7 SIP Product Enablers
      8. 7.8 Examples by SIP Product Type (1/2)
      9. 7.8 Examples by SIP Product Type (2/2)
      10. 7.9 Licensing SIP Products (1/2)
      11. 7.9 Licensing SIP Products (2/2)
      12. 7.10 Provider and Buyer Perspectives
      13. 7.11 The Evolution of the IP Industry
      14. 7.12 Intellectual Property Considerations
      15. 7.13 IP Outsourcing
      16. 7.14 Making IP Work in the Fabless Semiconductor Community
      17. 7.15 IP Acquisition Considerations for Fabless IC Companies
    5. Chapter 8: e-Commerce
      1. 8.1 The Virtual Fab Challenge
      2. 8.2 Semiconductor & Fabless Manufacturing: What is Different?
      3. 8.3 "Build to Forecast" for Outsourced Manufacturing
      4. 8.4 ERP System Solutions
      5. 8.5 The Information Ecosystem: Where Communication is Key (1/2)
      6. 8.5 The Information Ecosystem: Where Communication is Key (2/2)
    6. Chapter 9: Quality and Reliability
      1. 9.1 General
      2. 9.2 Front-End
      3. 9.3 Back-End
      4. 9.4 Environment, Health and Safety
    7. Chapter 10: Test Development
      1. 10.1 Simplifying Outsourced Test Development
      2. 10.2 Preparation
      3. 10.3 Evaluation
      4. 10.4 Conclusion
  10. PART 3 – Becoming a Best-in-Class Fabless Company
    1. Chapter 11: Best Practices for Fabless Companies
      1. 11.1 Achieving Best-in-Class Operations Practices
      2. 11.2 A Foundry Manager's Role in a Fabless Company
      3. 11.3 Closing the Loop: Understanding the Manufacturing Flow
      4. 11.4 Managing a Virtual Manufacturing Chain
    2. Chapter 12: Building the Right Partnerships
      1. 12.1 Suppliers are (Almost) Just as Important as Customers
      2. 12.2 Operations in a Fabless Start-Up
      3. 12.3 Legal Issues for Fabless Semiconductor Companies
      4. 12.4 Semiconductor Back-End Subcontracting: No Longer a Zero-Sum Game
    3. Chapter 13: Building the Right Relationships with the Board and VCs
      1. 13.1 Creating Successful Corporate Boards in Fabless Companies
      2. 13.2 Finding the Right VC (1/2)
      3. 13.2 Finding the Right VC (2/2)
  11. PART 4 – The Fabless Business Model: A Look into the Future
    1. Chapter 14: Perspectives into the Future of Fabless
      1. 14.1 Keeping Up with the Pace of Change in a Fabless World
      2. 14.2 Foundry Roadmaps: Partnering, Leading and Innovating
      3. 14.3 Semiconductor Manufacturing in the 21st Century (1/3)
      4. 14.3 Semiconductor Manufacturing in the 21st Century (2/3)
      5. 14.3 Semiconductor Manufacturing in the 21st Century (3/3)
      6. 14.4 The Emerging Dominance of China in the Technology and End Markets (1/2)
      7. 14.4 The Emerging Dominance of China in the Technology and End Markets (2/2)
  12. Appendix: Overall Semiconductor Revenues in 2006 (Public Companies) (1/2)
  13. Appendix: Overall Semiconductor Revenues in 2006 (Public Companies) (2/2)
  14. Bibliography
  15. Glossary of Terms and Acronyms
    1. A
    2. B
    3. C
    4. D
    5. E
    6. F
    7. G
    8. H
    9. I
    10. J
    11. L
    12. M
    13. N
    14. O
    15. P
    16. R
    17. S
    18. T
    19. V
    20. W
    21. Y
  16. About the Authors
  17. About FSA
  18. Index
    1. A
    2. B
    3. C
    4. D
    5. E
    6. F
    7. G
    8. H
    9. I
    10. K
    11. L
    12. M
    13. N
    14. O
    15. P
    16. Q
    17. R
    18. S
    19. T
    20. U
    21. V
    22. W
    23. X
    24. Y

Product information

  • Title: Understanding Fabless IC Technology
  • Author(s): Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya
  • Release date: April 2011
  • Publisher(s): Newnes
  • ISBN: 9780080551197