Chapter 21. Post-Silicon Debug and Characterization (“Bring-up”) and Product Qualification
21.1 Systematic Test Fails
During wafer testing, the set of failing dies may indicate that a systematic defect is present. As described in Section 19.7, test diagnostic procedures are pursued in an attempt to localize and determine the root cause of a defect. The ATPG tool flow is exercised in diagnostic mode, using the failing pattern syndrome to identify candidate faults. Physical locations on the die (and masks) are cross-referenced to the candidate faults for further investigation.
After wafer testing, good dies will be packaged and (likely) subjected to burn-in stress to screen infant fails. After (static or dynamic) burn-in, parts are retested. ...
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