3D Integration for VLSI Systems

Chapter 4 TSV ETCHING

Paul Werbaneth

Tegal Corporation

Through Silicon Via (TSV) Etching is a key process fabrication module employed in 3D IC technologies. While there are yet to be significant volumes of commercially available TSV-based packaged devices in silicon IC technologies today, there are scores of TSV development activities currently underway within programs organized by semiconductor capital equipment consortia, university research centers, Integrated Devices Manufacturers, packaging houses, and various national and international government-sponsored efforts. Many 3D technology topics require substantial new progress be made on difficult areas of process technology, for example low-temperature deposition of dielectric films ...