3D Integration for VLSI Systems

Chapter 6 3D TECHNOLOGY PLATFORM: TEMPORARY BONDING AND RELEASE

Mark Privett

Brewer Science, Inc.

6.1 BACKGROUND AND INTRODUCTION

Frequently referred to as a “more than Moore approach,” stacking of ICs with the use of through-silicon vias (TSVs) was identified as “another direction of improvement” of computing power as early as 1985.¹ From 1985 until the early part of this decade, improvements in lithography and packaging have delivered on the promise of Moore’s law, but limitations in lithographic technology and packaging are making costs for further improvements prohibitively high. TSV technology has had limited usage in high-volume production to date because the creation of TSVs in wafers more than 100 μm thick is both time consuming ...