3D Integration for VLSI Systems

Chapter 9 ADVANCED DIRECT BOND TECHNOLOGY

Paul Enquist

Ziptronix, Inc.

9.1 INTRODUCTION

New technology platforms are adopted as application requirements exceed the capabilities of installed technology platforms. The inherent scalability of conventional planar semiconductor manufacturing technology¹ has allowed continuous improvements in conventional technology platforms like lithography, front end processes, and interconnect to meet customer demands for over 40 years. The interconnect technology platform has become an impediment in allowing continuation of this improvement due to fundamental limitations that arise from increasing parasitics that result in increased power consumption and signal delay.² Increasing market demand for mobile ...