Chapter 11 THROUGH SILICON VIA IMPLEMENTATION IN CMOS IMAGE SENSOR PRODUCT
STMicroelectronics
INTRODUCTION TO TSV TECHNOLOGY APPLIED TO CAMERA MODULE
The camera module business started early 2001 with the first integration of image capture capability inside a mobile phone. Over the last 10 years this market has been booming thanks to the very fast evolution of CMOS sensor performances combined with and endlessly demand for higher resolution camera and sophisticated image processing capability.
In parallel to the fast evolution of CMOS sensor silicon process the packaging technologies have followed the same trend not only on the performance side but also on the physical dimensions. Figure 1 illustrates ...
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