Book description
A synergistic approach to signal integrity for high-speed digital design
This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital design—creating the optimal combination between theory and practical applications.
Following an introduction to the importance of signal integrity, chapter coverage includes:
Electromagnetic fundamentals for signal integrity
Transmission line fundamentals
Crosstalk
Non-ideal conductor models, including surface roughness and frequency-dependent inductance
Frequency-dependent properties of dielectrics
Differential signaling
Mathematical requirements of physical channels
S-parameters for digital engineers
Non-ideal return paths and via resonance
I/O circuits and models
Equalization
Modeling and budgeting of timing jitter and noise
System analysis using response surface modeling
Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material. Advanced Signal Integrity for High-Speed Digital Designs is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.
Table of contents
- Cover
- Title page
- Preface
- 1: Introduction: The Importance of Signal Integrity
- 2: ELECTROMAGNETIC FUNDAMENTALS FOR SIGNAL INTEGRITY
- 3: IDEAL TRANSMISSION-LINE FUNDAMENTALS
- 4: CROSSTALK
- 5: NONIDEAL CONDUCTOR MODELS
-
6: ELECTRICAL PROPERTIES OF DIELECTRICS
- 6.1 POLARIZATION OF DIELECTRICS
- 6.2 CLASSIFICATION OF DIELECTRIC MATERIALS
- 6.3 FREQUENCY-DEPENDENT DIELECTRIC BEHAVIOR
- 6.4 PROPERTIES OF A PHYSICAL DIELECTRIC MODEL
- 6.5 FIBER-WEAVE EFFECT
- 6.6 ENVIRONMENTAL VARIATION IN DIELECTRIC BEHAVIOR
- 6.7 TRANSMISSION-LINE PARAMETERS FOR LOSSY DIELECTRICS AND REALISTIC CONDUCTORS
- REFERENCES
- PROBLEMS
- 7: DIFFERENTIAL SIGNALING
- 8: MATHEMATICAL REQUIREMENTS FOR PHYSICAL CHANNELS
- 9: NETWORK ANALYSIS FOR DIGITAL ENGINEERS
- 10: TOPICS IN HIGH-SPEED CHANNEL MODELING
-
11: I/O CIRCUITS AND MODELS
- 11.1 I/O DESIGN CONSIDERATIONS
- 11.2 PUSH-PULL TRANSMITTERS
- 11.3 CMOS RECEIVERS
- 11.4 ESD PROTECTION CIRCUITS
- 11.5 ON-CHIP TERMINATION
- 11.6 BERGERON DIAGRAMS
- 11.7 OPEN-DRAIN TRANSMITTERS
- 11.8 DIFFERENTIAL CURRENT-MODE TRANSMITTERS
- 11.9 LOW-SWING AND DIFFERENTIAL RECEIVERS
- 11.10 IBIS MODELS
- 11.11 SUMMARY
- REFERENCES
- PROBLEMS
- 12: EQUALIZATION
- 13: MODELING AND BUDGETING OF TIMING JITTER AND NOISE
-
14: SYSTEM ANALYSIS USING RESPONSE SURFACE MODELING
- 14.1 MODEL DESIGN CONSIDERATIONS
- 14.2 CASE STUDY: 10-GB/S DIFFERENTIAL PCB INTERFACE
- 14.3 RSM CONSTRUCTION BY LEAST SQUARES FITTING
- 14.4 MEASURES OF FIT
- 14.5 SIGNIFICANCE TESTING
- 14.6 CONFIDENCE INTERVALS
- 14.7 SENSITIVITY ANALYSIS AND DESIGN OPTIMIZATION
- 14.8 DEFECT RATE PREDICTION USING MONTE CARLO SIMULATION
- 14.9 ADDITIONAL RSM CONSIDERATIONS
- 14.10 SUMMARY
- REFERENCES
- PROBLEMS
- APPENDIX A: USEFUL FORMULAS, IDENTITIES, UNITS, AND CONSTANTS
- APPENDIX B: FOUR-PORT CONVERSIONS BETWEEN T- AND S-PARAMETERS
- APPENDIX C: CRITICAL VALUES OF THE F-STATISTIC
- APPENDIX D: CRITICAL VALUES OF THE T-STATISTIC
- APPENDIX E: CAUSAL RELATIONSHIP BETWEEN SKIN EFFECT RESISTANCE AND INTERNAL INDUCTANCE FOR ROUGH CONDUCTORS
- APPENDIX F: SPICE LEVEL 3 MODEL FOR 0.25 μM MOSIS PROCESS
- INDEX
Product information
- Title: Advanced Signal Integrity For High-Speed Digital Designs
- Author(s):
- Release date: March 2009
- Publisher(s): Wiley-IEEE Press
- ISBN: 9780470192351
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