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Architecting High-Performance Embedded Systems
book

Architecting High-Performance Embedded Systems

by Jim Ledin
February 2021
Intermediate to advanced content levelIntermediate to advanced
376 pages
9h 6m
English
Packt Publishing
Content preview from Architecting High-Performance Embedded Systems

Chapter 7: Building High-Performance Digital Circuits

This chapter presents the processes and techniques involved in assembling prototype high-performance digital circuits using surface-mount and through-hole electronic components. A recommended set of tools will be identified, including a soldering station, a magnifier or microscope, and tweezers for handling tiny parts. The reflow soldering process will also be introduced, along with descriptions of some low-cost options for implementing a small-scale reflow capability.

Preparations for circuit assembly and the techniques of soldering by hand and with the reflow process will be presented in a manner that allows them to be applied to a wide variety of projects. Once soldering is complete, the ...

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Publisher Resources

ISBN: 9781789955965Supplemental Content