February 2021
Intermediate to advanced
376 pages
9h 6m
English
This chapter presents the processes and techniques involved in assembling prototype high-performance digital circuits using surface-mount and through-hole electronic components. A recommended set of tools will be identified, including a soldering station, a magnifier or microscope, and tweezers for handling tiny parts. The reflow soldering process will also be introduced, along with descriptions of some low-cost options for implementing a small-scale reflow capability.
Preparations for circuit assembly and the techniques of soldering by hand and with the reflow process will be presented in a manner that allows them to be applied to a wide variety of projects. Once soldering is complete, the ...