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Bebop to the Boolean Boogie, 3rd Edition by Clive Maxfield

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Chapter 20. Advanced Packaging Techniques

Sliding down the rabbit hole

Traditionally, integrated circuits, hybrids, and printed circuit boards were differentiated on the basis of their substrate materials: semiconductors (mainly silicon), ceramics, and organics, respectively. Unfortunately, even this simple categorization is less than perfect. Some hybrids use laminate substrates, which are, to all intents and purposes, small printed circuit boards. So, at what point does a printed circuit board become a hybrid with a laminate substrate?

The problem is exacerbated in the case of System-in-Package (SiP), which is a generic name for a group of advanced interconnection and packaging technologies featuring multiple integrated circuits (which may ...

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