December 2008
Intermediate to advanced
568 pages
16h 16m
English
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Chapter 20. Advanced Packaging Techniques
Sliding down the rabbit hole
Traditionally, integrated circuits, hybrids, and printed circuit boards were differentiated on the basis of their substrate materials: semiconductors (mainly silicon), ceramics, and organics, respectively. Unfortunately, even this simple categorization is less than perfect. Some hybrids use laminate substrates, which are, to all intents and purposes, small printed circuit boards. So, at what point does a printed circuit board become a hybrid with a laminate substrate?
The problem is exacerbated in the case of System-in-Package (SiP), which is a generic name for a group of advanced interconnection and packaging technologies featuring multiple integrated circuits (which may ...
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I wanted to learn C and C++, but it didn't click for me until I picked up an O'Reilly book. When I went on the O’Reilly platform, I was astonished to find all the books there, plus live events and sandboxes so you could play around with the technology.Addison B.
I’ve been on the O’Reilly platform for more than eight years. I use a couple of learning platforms, but I'm on O'Reilly more than anybody else. When you're there, you start learning. I'm never disappointed.Amir M.
I'm always learning. So when I got on to O'Reilly, I was like a kid in a candy store. There are playlists. There are answers. There's on-demand training. It's worth its weight in gold, in terms of what it allows me to do.