Chapter 1. Integration and devices
What type of structures are required for thick-film devices, why is it difficult to make them, and how can the challenges be overcome?
1.2 Structure of Film Devices2
1.3 Obstacles to Integration7
1.3.4 Size really does matter10
1.4 Overcoming Challenges11
1.4.1 Reducing temperature11
1.4.2 Separating reactants15
1.4.3 Decrease differential strain16
1.4.5 Increase in strength19
1.5 Overview of Functional Devices20
1.5.2 Piezoelectric devices21
184.108.40.206 Actuators, speakers, and pumps22
220.127.116.11 Sound and acoustic emission sensors22
18.104.22.168 Ultrasound transducers23
22.214.171.124 Acceleration sensors ...