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Ceramic Thick Films for MEMS and Microdevices by Robert A. Dorey

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Chapter 1. Integration and devices
What type of structures are required for thick-film devices, why is it difficult to make them, and how can the challenges be overcome?

Chapter Outline

1.1 Introduction2
1.2 Structure of Film Devices2
1.3 Obstacles to Integration7
1.3.1 Thermal7
1.3.2 Thermo-chemical8
1.3.3 Thermo-chemo-mechanical9
1.3.4 Size really does matter10
1.4 Overcoming Challenges11
1.4.1 Reducing temperature11
1.4.2 Separating reactants15
1.4.3 Decrease differential strain16
1.4.4 Make it thinner17
1.4.5 Increase in strength19
1.5 Overview of Functional Devices20
1.5.1 Introduction20
1.5.2 Piezoelectric devices21
1.5.2.1 Actuators, speakers, and pumps22
1.5.2.2 Sound and acoustic emission sensors22
1.5.2.3 Ultrasound transducers23
1.5.2.4 Acceleration sensors ...

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