Chapter 1. Integration and devices
What type of structures are required for thick-film devices, why is it difficult to make them, and how can the challenges be overcome?
1.2 Structure of Film Devices2
1.3 Obstacles to Integration7
1.3.4 Size really does matter10
1.4 Overcoming Challenges11
1.4.1 Reducing temperature11
1.4.2 Separating reactants15
1.4.3 Decrease differential strain16
1.4.5 Increase in strength19
1.5 Overview of Functional Devices20
1.5.2 Piezoelectric devices21
126.96.36.199 Actuators, speakers, and pumps22
188.8.131.52 Sound and acoustic emission sensors22
184.108.40.206 Ultrasound transducers23
220.127.116.11 Acceleration sensors ...