Characterization of Integrated Circuit Packaging Materials

Table of contents

1. Front Cover
2. Characterization of Integrated Circuit Packaging Materials
3. Copyright Page
4. Table of Contents (1/2)
5. Table of Contents (2/2)
6. Foreword
7. Preface to Series
8. Preface
9. Contributors
10. Chapter 1. IC Package Reliability Testing
    1. 1.1 Introduction
    2. 1.2 In-Process Quality Measurements (1/2)
    3. 1.2 In-Process Quality Measurements (2/2)
    4. 1.3 Package-Oriented Reliability Testing of Finished Devices:Moisture Testing
    5. 1.4 Package-Oriented Reliability Testing of Finished Devices:Thermal Cycle Testing (1/2)
    6. 1.4 Package-Oriented Reliability Testing of Finished Devices:Thermal Cycle Testing (2/2)
    7. 1.5 Reliability Test Preconditioning: A New Direction
    8. 1.6 Summary
    9. References
11. Chapter 2. Mold Compound Adhesion and Strength
    1. 2.1 Introduction
    2. 2.2 Thermodynamic Consideration of Adhesion
    3. 2.3 Adhesive Strength for Various Mold Compound Types
    4. 2.4 Various Factors Which Influence Adhesion Strength (1/2)
    5. 2.4 Various Factors Which Influence Adhesion Strength (2/2)
    6. 2.5 Role of Adhesion in Surface Mount Operations
    7. 2.6 Role of Adhesion in Package Reliability
    8. 2.7 Physical Characterization of Mold Compounds
    9. 2.8 Outlook for Future Mold Compounds
    10. 2.9 Summary
    11. References
12. Chapter 3. Mechanical Stress in IC Packages
    1. 3.1 Introduction
    2. 3.2 Stress and Strain Relations: An Overview
    3. 3.3 Stress Generation in IC Packages
    4. 3.4 Tools for Stress Determination in IC Packages
    5. 3.5 Application of Techniques to IC Packaging Problems (1/3)
    6. 3.5 Application of Techniques to IC Packaging Problems (2/3)
    7. 3.5 Application of Techniques to IC Packaging Problems (3/3)
    8. 3.6 Solder Joint Stress and the Coffin—Manson Relation
    9. 3.7 Summary
    10. References
13. Chapter 4. Moisture Sensitivity and Delamination
    1. 4.1 Introduction
    2. 4.2 Moisture/Reflow Sensitivity Evaluations (1/2)
    3. 4.2 Moisture/Reflow Sensitivity Evaluations (2/2)
    4. 4.3 Impact on Temperature-Cycle Performance
    5. 4.4 Impact on THB Performance
    6. 4.5 Moisture Desorption: Bake-Out
    7. 4.6 Summary
    8. References
14. Chapter 5. Thermal Management
    1. 5.1 Introduction
    2. 5.2 IC Package Thermal Characteristics (1/2)
    3. 5.2 IC Package Thermal Characteristics (2/2)
    4. 5.3 Factors Affecting Package Thermal Resistance (1/2)
    5. 5.3 Factors Affecting Package Thermal Resistance (2/2)
    6. 5.4 Thermal Design Challenges of Multi-Chip Modules
    7. 5.5 Summary
    8. References
15. Chapter 6. Electrical Performance of IC Packages
    1. 6.1 Introduction
    2. 6.2 Designing for Performance
    3. 6.3 Electrical Models for Packages and Interconnects
    4. 6.4 Propagation Delay and Packaging
    5. 6.5 Switching Noise
    6. 6.6 Signal Integrity
    7. 6.7 Crosstalk
    8. 6.8 Materials and Design Trends for High-Performance Packaging
    9. 6.9 Summary
    10. References
16. Chapter 7. Solderability of Integrated Circuits
    1. 7.1 Introduction
    2. 7.2 Electronic Soldering Basics
    3. 7.3 IC Package Designs, Materials, and Solderability Test Methods
    4. 7.4 IC Solderability Defects (1/2)
    5. 7.4 IC Solderability Defects (2/2)
    6. 7.5 Solderability of IC Packages to PCBs
    7. 7.6 Summary
    8. References
17. Chapter 8. Hermeticity and Joining in Ceramic IC Packages
    1. 8.1 Introduction
    2. 8.2 Materials for Hermetic IC Packaging
    3. 8.3 Hermeticity Testing—History
    4. 8.4 Theory of Hermeticity Testing
    5. 8.5 Gross-Leak Testing Methodology
    6. 8.6 Hermeticity Failure Analysis
    7. 8.7 Alternatives to Hermetic Packaging
    8. 8.8 Summary
    9. References
18. Chapter 9. Advanced Interconnect Technologies
    1. 9.1 Introduction
    2. 9.2 MCM Technology Classifications
    3. 9.3 MCM Materials Selection (1/2)
    4. 9.3 MCM Materials Selection (2/2)
    5. 9.4 Die Mounting and Stress
    6. 9.5 Die Interconnection
    7. 9.6 MCM Packages
    8. 9.7 Summary
    9. References
19. Appendix: Technique Summaries
    1. Acoustic Microscopy (C-AM)
    2. Atomic Absorption Spectrometry (AAS)
    3. Auger Electron Spectroscopy (AES)
    4. Ceramic Plate Test (CPT) for Evaluating the Solderability of IC Devices
    5. Coulometric Method for Solderability Evaluation
    6. Decapsulation Techniques
    7. Differential Scanning Calorimetry (DSC)
    8. Dynamic Mechanical Analysis
    9. Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)
    10. Electron Probe X-Ray Microanalysis (EPMA)
    11. Energy-Dispersive X-Ray Spectroscopy (EDS)
    12. Finite Element Analysis (FEA)
    13. Fourier Transform Infrared Spectroscopy (FTIR)
    14. Inductively Coupled Plasma Mass Spectrometry (ICPMS)
    15. Inductively Coupled Plasma-Optical Emission Spectroscopy (ICP-OES)
    16. In Situ Strain Gauges
    17. Ion Chromatography
    18. Mechanical Testing in IC Packaging
    19. Scanning Electron Microscopy (SEM)
    20. Scanning Tunneling Microscopy (STM) and Scanning Force Microscopy (SFM)
    21. Static Secondary Ion Mass Spectrometry (Static SIMS)
    22. Thermogravimetric Analysis (TGA)
    23. Thermomechanical Analysis (TMA)
    24. Torsional Braid Analysis (TBA)
    25. Wetting Balance Method to Evaluate the Solderability of IC Devices
    26. X-Ray Laminography
    27. X-Ray Photoeiectron Spectroscopy (XPS)
    28. X-Ray Radiographic Inspection
20. Index (1/2)
21. Index (2/2)