Appendix B
Partial list of packages and footprints and some of the footprints included in OrCAD PCB Editor
Table B.1
| Abbreviation | Full name | Footprint examples in library share\pcb\pcb_lib\symbols |
|---|---|---|
| BDIP (SDIP) | Butt-mounted dual inline package (surface DIP, std pitch) | – |
| BGA | Ball grid array | bga6m10020b60w700… |
| bga39m1271521b76w5000 | ||
| named as bgaNmSPbDwW | ||
| where N=number of rows | ||
| S=pitch in mm | ||
| P=number of pads | ||
| D=pad diameter | ||
| W=package width | ||
| BQFP | Bumper quad flat package | quadb02544wg535… |
| quadb025244wg1780ctx | ||
| CBGA | Ceramic column ball grid array | – |
| CFP | Ceramic flat packages | flat14…flat64 |
| CGA | Column grid array | cpga68…cpga262 |
| CQFP | Ceramic quad flat packages | quadflat24, mquad28 |
| cqfp44_amd… | ||
| cqfp208_alt | ||
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