O'Reilly logo

Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning by Kashmiri L. Mittal, Rajiv Kohli

Stay ahead with the world's most comprehensive technology and business learning platform.

With Safari, you learn the way you learn best. Get unlimited access to videos, live online training, learning paths, books, tutorials, and more.

Start Free Trial

No credit card required

Chapter 4

Brush Scrubbing for Post-CMP Cleaning

Ting Sun1, Zhenxing Han2 and Manish Keswani3,    1Sichuan Normal University, Chengdu, Sichuan, China,    2Micron Technology Inc., Boise, ID, United States,    3University of Arizona, Tucson, AZ, United States

Abstract

To achieve a defect-free wafer surface, slurry residuals and other contaminants are required to be removed after a chemical mechanical planarization (CMP) process. Brush scrubbing, a process based on direct contact between a soft polyvinyl alcohol (PVA) brush and the wafer surface is widely accepted in post-CMP cleaning due to process flexibility, single-wafer processing configuration, and reduced cost of ownership. Researches have shown that the cleaning performance of the brush scrubbing ...

With Safari, you learn the way you learn best. Get unlimited access to videos, live online training, learning paths, books, interactive tutorials, and more.

Start Free Trial

No credit card required