Asymmetric stripline (Section 6.6): Traces between conducting planes that are not centered.
Centered stripline (Section 6.4): Traces that are on an inner layer of a circuit board that are evenly positioned between two conducting surfaces.
Clad laminate (Section 6.8): A glass epoxy layer with copper bonded to one or both surfaces.
Core (Section 6.1): The laminate structure used at the center of a circuit board. It is often glass epoxy with thin layers of copper bonded to the two surfaces.
Layer stack (Section 6.8): The set of laminates that make up a circuit board.
Layup (Section 6.8): The layers in their right order that make up a final circuit board.
Manhattan (Section 6.7): The xy pattern of traces similar to avenues and streets in the New York City.
Maxwell's equations (Section 6.2): A set of differential equations that describes all field phenomena in electricity.
Oz copper: A thickness of copper. When two pounds of copper are plated on 1 ft2 of material, the copper thickness is 2.7 mil. This is called 2-oz copper. The final thickness can change during manufacturing.
Prepreg (Section 6.8): Partially cured glass epoxy. When the layer stack is heated under pressure, the epoxy cures bonding laminate surfaces together.
Thieving (Section 6.8): In plating, areas with less copper are apt to receive an excess of plating. Adding pads of copper to a surface tends to even out the plating. The pads steal plating material from nearby points on the board.
1 IPC stands ...