List of Contributors
Ethan C. Ahn, Department of Electrical Engineering, Stanford University, USA
Masakazu Aono, WPI Center for Materials Nanoarchitectonics, National Institute for Materials Science, Japan
Tetsuya Asai, Graduate School of Information Science and Technology, Hokkaido University, Japan
Behtash Behin-Aein, GLOBALFOUNDRIES Inc., USA
Benjamin F. Bory, Eindhoven University of Technology, The Netherlands
George Bourianoff, Components Research Group, Intel Corporation, USA
Geoffrey W. Burr, IBM, USA
An Chen, GLOBALFOUNDRIES Inc., USA
Donald M. Chiarulli, Department of Electrical and Computer Engineering, University of Pittsburgh, USA
György Csaba, University of Notre Dame, USA
Shamik Das, Nanosystems Group, The MITRE Corporation, USA
Denver H. Dash, Intel Science and Technology Center, USA
Supriyo Datta, Purdue University, USA
Vinh Quang Diep, Purdue University, USA
S. Burc Eryilmaz, Department of Electrical Engineering, Stanford University, USA
Yan Fang, Department of Electrical and Computer Engineering, University of Pittsburgh, USA
Scott Fong, Department of Electrical Engineering, Stanford University, USA
Aaron D. Franklin, Department of Electrical and Computer Engineering and Department of Chemistry, Duke University, USA
Paul Franzon, North Carolina State University, USA
Tsuyoshi Hasegawa, WPI Center for Materials Nanoarchitectonics, National Institute for Materials Science, Japan
Toshiro Hiramoto, Institute of Industrial Science, The University of Tokyo, Japan ...
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