Appendix C
mbed Technical Data
C.1. Summarizing Technical Details of the mbed
The mbed is built around an LPC1768 microcontroller, made by NXP semiconductors. The LPC1768 is in turn designed around an ARM Cortex-M3 core, with 512 KB FLASH memory, 64 KB RAM, and a wide range of interfaces, including Ethernet, USB Device, CAN, SPI, I2C, and other I/O. It runs at 96 MHz.
Summary mbed characteristics and operating conditions are given below.
Package
• 40-pin DIP package, with 0.1 inch spacing between pins, and 0.9 inches between the two rows.
• Overall size: 2 inch × 1 inch, 53 mm × 26 mm.
Power
• Powered through the USB connection, or 4.5–9.0 V applied to VIN (see Fig. 2.1).
• Power consumption <200 mA (100 mA approximate with Ethernet disabled).
• Real-time ...
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