Future Trends in Microelectronics: Up the Nano Creek

Robust Metallic Interconnects for FlexibleElectronics and Bioelectronics

D. P. Wang, F. Y. Biga, A. Zaslavsky, and G. P. Crawford

Division of Engineering, Brown University, Providence, RI 02912, U.S.A.

1.   Introduction

Integrated interconnects for electronic applications have traditionally been restricted to planar rigid substrates that place negligible mechanical constraints on their performance. However, the continued interest in flexible electronic applications and convergence of biomedical implants with conventional electronics, necessitates the development of robust flexible interconnect schemes. Flexible electronics will encompass many applications, such as wearable electronics, large-area sensor arrays, bendable and conformal solar cell arrays, flexible displays, as well as flexible (and possibly stretchable) implantable biosensors.

In the case of next generation flexible displays, flexible interconnects are seen as one of the key enabling technologies that will bring the concept of rollable and bendable screens to fruition. Flexible display applications, which broadly include bendable, conformable and rollable displays,¹ will require flexible substrates, electronic components, optical layers as well as robust circuitry for functionality and reliable performance. Figure 1 shows a concept flexible display that allows for full rollability, similar to a conventional newspaper.

Figure 1.  A concept flexible display device that can be rolled out to show an image and rolled ...