Green Electronics Manufacturing

Green Electronics Manufacturing

by John X. Wang
Released July 2012
Publisher(s): CRC Press
ISBN: 9781439826690

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Book description

Written for scientists and engineers involved in creating environmentally sensible products and technologies, Green Electronic Manufacturing offers an approach to designing electronics with special consideration for the environmental impacts of the product during its entire lifecycle, from raw material mining to end-of-life disposal or recycling. Examining the vast implications of eco-design on business and technology, this book goes beyond "green-practice" in the manufacturing process to discuss responsible electronics development as a management philosophy, design paradigm, and corporate culture toward an ultimately holistic environmental custodianship and commitment to society.

Table of contents

  1. Front Cover
  2. Dedication
  3. Contents (1/2)
  4. Contents (2/2)
  5. Preface
  6. About the Author
  7. 1. Green Electronic Assembly: Strategic Industry Interconnection Direction (1/5)
  8. 1. Green Electronic Assembly: Strategic Industry Interconnection Direction (2/5)
  9. 1. Green Electronic Assembly: Strategic Industry Interconnection Direction (3/5)
  10. 1. Green Electronic Assembly: Strategic Industry Interconnection Direction (4/5)
  11. 1. Green Electronic Assembly: Strategic Industry Interconnection Direction (5/5)
  12. 2. Tin Whiskers: New Challenge for Long-Term RoHS Reliability (1/4)
  13. 2. Tin Whiskers: New Challenge for Long-Term RoHS Reliability (2/4)
  14. 2. Tin Whiskers: New Challenge for Long-Term RoHS Reliability (3/4)
  15. 2. Tin Whiskers: New Challenge for Long-Term RoHS Reliability (4/4)
  16. 3. Fatigue Characterization of Lead-Free Solders (1/5)
  17. 3. Fatigue Characterization of Lead-Free Solders (2/5)
  18. 3. Fatigue Characterization of Lead-Free Solders (3/5)
  19. 3. Fatigue Characterization of Lead-Free Solders (4/5)
  20. 3. Fatigue Characterization of Lead-Free Solders (5/5)
  21. 4. Lead-Free Electronic Reliability: Finite Element Modeling (1/5)
  22. 4. Lead-Free Electronic Reliability: Finite Element Modeling (2/5)
  23. 4. Lead-Free Electronic Reliability: Finite Element Modeling (3/5)
  24. 4. Lead-Free Electronic Reliability: Finite Element Modeling (4/5)
  25. 4. Lead-Free Electronic Reliability: Finite Element Modeling (5/5)
  26. 5. Lead-Free Electronic Reliability: Fatigue Life Model (1/6)
  27. 5. Lead-Free Electronic Reliability: Fatigue Life Model (2/6)
  28. 5. Lead-Free Electronic Reliability: Fatigue Life Model (3/6)
  29. 5. Lead-Free Electronic Reliability: Fatigue Life Model (4/6)
  30. 5. Lead-Free Electronic Reliability: Fatigue Life Model (5/6)
  31. 5. Lead-Free Electronic Reliability: Fatigue Life Model (6/6)
  32. 6. Lead-Free Electronic Reliability: Higher Temperature (1/5)
  33. 6. Lead-Free Electronic Reliability: Higher Temperature (2/5)
  34. 6. Lead-Free Electronic Reliability: Higher Temperature (3/5)
  35. 6. Lead-Free Electronic Reliability: Higher Temperature (4/5)
  36. 6. Lead-Free Electronic Reliability: Higher Temperature (5/5)
  37. 7. Fatigue Design of Lead-Free Electronics and Weibull Distribution (1/7)
  38. 7. Fatigue Design of Lead-Free Electronics and Weibull Distribution (2/7)
  39. 7. Fatigue Design of Lead-Free Electronics and Weibull Distribution (3/7)
  40. 7. Fatigue Design of Lead-Free Electronics and Weibull Distribution (4/7)
  41. 7. Fatigue Design of Lead-Free Electronics and Weibull Distribution (5/7)
  42. 7. Fatigue Design of Lead-Free Electronics and Weibull Distribution (6/7)
  43. 7. Fatigue Design of Lead-Free Electronics and Weibull Distribution (7/7)
  44. 8. Enhancing Reliability of Ball Grid Array (1/5)
  45. 8. Enhancing Reliability of Ball Grid Array (2/5)
  46. 8. Enhancing Reliability of Ball Grid Array (3/5)
  47. 8. Enhancing Reliability of Ball Grid Array (4/5)
  48. 8. Enhancing Reliability of Ball Grid Array (5/5)
  49. 9. Finite Element Modeling under High-Vibration and High-Temperature Environments (1/4)
  50. 9. Finite Element Modeling under High-Vibration and High-Temperature Environments (2/4)
  51. 9. Finite Element Modeling under High-Vibration and High-Temperature Environments (3/4)
  52. 9. Finite Element Modeling under High-Vibration and High-Temperature Environments (4/4)
  53. 10. Probabilistic Modeling of the Elastic-Plastic Behavior of 63Sn-37Pb Solder Alloys (1/5)
  54. 10. Probabilistic Modeling of the Elastic-Plastic Behavior of 63Sn-37Pb Solder Alloys (2/5)
  55. 10. Probabilistic Modeling of the Elastic-Plastic Behavior of 63Sn-37Pb Solder Alloys (3/5)
  56. 10. Probabilistic Modeling of the Elastic-Plastic Behavior of 63Sn-37Pb Solder Alloys (4/5)
  57. 10. Probabilistic Modeling of the Elastic-Plastic Behavior of 63Sn-37Pb Solder Alloys (5/5)
  58. 11. Flip-Chip Assembly for Lead-Free Electronics (1/5)
  59. 11. Flip-Chip Assembly for Lead-Free Electronics (2/5)
  60. 11. Flip-Chip Assembly for Lead-Free Electronics (3/5)
  61. 11. Flip-Chip Assembly for Lead-Free Electronics (4/5)
  62. 11. Flip-Chip Assembly for Lead-Free Electronics (5/5)
  63. 12. Flip-Chip Bonding Technique for Lead-Free Electronics (1/6)
  64. 12. Flip-Chip Bonding Technique for Lead-Free Electronics (2/6)
  65. 12. Flip-Chip Bonding Technique for Lead-Free Electronics (3/6)
  66. 12. Flip-Chip Bonding Technique for Lead-Free Electronics (4/6)
  67. 12. Flip-Chip Bonding Technique for Lead-Free Electronics (5/6)
  68. 12. Flip-Chip Bonding Technique for Lead-Free Electronics (6/6)
  69. 13. Flip-Chip Bonding of Opto-Electronic Integrated Circuits (1/5)
  70. 13. Flip-Chip Bonding of Opto-Electronic Integrated Circuits (2/5)
  71. 13. Flip-Chip Bonding of Opto-Electronic Integrated Circuits (3/5)
  72. 13. Flip-Chip Bonding of Opto-Electronic Integrated Circuits (4/5)
  73. 13. Flip-Chip Bonding of Opto-Electronic Integrated Circuits (5/5)
  74. 14. Let’s Package a Lead-Free Electronic Design (1/6)
  75. 14. Let’s Package a Lead-Free Electronic Design (2/6)
  76. 14. Let’s Package a Lead-Free Electronic Design (3/6)
  77. 14. Let’s Package a Lead-Free Electronic Design (4/6)
  78. 14. Let’s Package a Lead-Free Electronic Design (5/6)
  79. 14. Let’s Package a Lead-Free Electronic Design (6/6)

Product information

  • Title: Green Electronics Manufacturing
  • Author(s): John X. Wang
  • Release date: July 2012
  • Publisher(s): CRC Press
  • ISBN: 9781439826690