Handbook of 3D Integration, Volume 4

13D Design Styles

Paul D. Franzon

North Carolina State University, 2410 Campus Shore Dr., Raleigh, NC, 27606, USA

1.1 Introduction

3D‐IC and interposer technologies have demonstrated their capability to reduce system size and weight, improve performance, reduce power consumption, and even improve cost as compared with baseline 2D integration approaches. Though not a replacement for Moore's law, 3D technologies can provide significant improvements in performance per unit of power and performance per unit of cost. The main purpose of this chapter is to provide an overview of product and design scenarios that uniquely leverage 3D‐IC technologies in 3D specific ways.

The structure of this chapter is as follows. First, we do a quick review of the ...