Chapter 4Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System
Alexander Steinhardt Dimitrios Papaioannou Andy Heinig and Peter Schneider
Fraunhofer Institute for Integrated Circuits (IIS), Division Engineering of Adaptive Systems (EAS), Zeunerstraße 38, 01069 Dresden, Germany
4.1 Introduction
Advanced packaging technologies open new perspectives for system designers. Fan‐in/fan‐out wafer‐level packaging technologies (e.g. eWLB) and 2.5D/3D integration (e.g. die stacking) as well as the combination of traditional system integration techniques (e.g. flip chip, wire bonding, package on package) enable an enrichment of the design space. Such advanced packaging technologies facilitate systems with reduced footprint ...
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