Chapter 6Design and CAD Solutions for Cooling and Power Delivery for Monolithic 3D‐ICs

Sandeep Samal and Sung K. Lim

Georgia Institute of Technology, Electrical & Computer Engineering, 791, Atlantic Dr NW, Atlanta, GA, 30332, USA

6.1 Introduction

The advent of 3D‐IC technology has opened up the potential of highly improved circuit designs. 3D‐ICs help in the continuation of Moore's law. Their major advantages include reduced interconnect length leading to low power and increased speed, reduced footprint area, high bandwidth, and integration of heterogeneous technology flavors. Through‐silicon vias (TSVs) enable the vertical integration of separate dies to form a single 3D chip. However, TSVs consume a lot of area and have very large capacitance. ...

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