Chapter 16Thermal Isolation and Cooling Technologies for Heterogeneous 3D‐ and 2.5D‐ICs
Yang Zhang Hanju Oh Yue Zhang Li Zheng Gary S. May and Muhannad S. Bakir
Georgia Institute of Technology, School of Electrical and Computer Engineering, 791Atlantic Dr NW, Atlanta, GA, 30332, USA
In this chapter, thermal challenges in heterogeneous three‐dimensional (3D) and 2.5D die integration architectures are briefly summarized. To solve these challenges, interposer‐ and tier‐embedded microfluidic cooling technologies are proposed in conjunction with thermal isolation technologies. Two novel architectures for 3D and 2.5D integration are proposed and thermally evaluated through modeling and experimental demonstrations. Moreover, to address off‐chip signaling ...
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