Handbook of 3D Integration, Volume 4

17Passive and Active Thermal Technologies: Modeling and Evaluation

Craig E. Green Vivek Sahu Yuanchen Hu Yogendra K. Joshi and Andrei G. Fedorov

Georgia Institute of Technology, Department of Mechanical Engineering, 801 Ferst Drive, Atlanta, GA, 30332‐0405, USA

17.1 Introduction

While the computational advantages of 3D stacked electronics are well detailed [1], their successful implementation is hampered by the inherent thermal demands of cooling multiple heat‐generating components stacked on top of one another. With traditional lid attached air cooling approaches nearing their limitations with traditional 2D packages [2], the increased volumetric heat generation associated with stacked designs necessitates new cooling approaches. The useful ...