19On the Thermal Management of 3D‐ICs: From Backside to Volumetric Heat Removal
Thomas Brunschwiler Gerd Schlottig Chin L. Ong Brian Burg and Arvind Sridhar
IBM Research – Zurich, Department of Science and Technology, Saeumerstrasse, 8803 Rueschlikon, Switzerland
19.1 Introduction: Density Scaling Drives Compute Performance and Efficiency
Over the last decades, we witnessed a tremendous improvement in compute performance, efficiency, and miniaturization of digital devices. The impact of the exponential progress can be exemplified by comparing the hardware and power required to achieve a sustainable LINPACK performance of 100 TFLOPS (tera floating point operations per second) (Figure 19.1). In 2005, 126 racks and 28 computer room air handler
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