Handbook of Silicon Based MEMS Materials and Technologies

5.2. Standard Measurements of Polished Wafers

Customer wafer specifications define what is measured and reported on finished wafers and are the measurements done either on a specified sampling plan or on all wafers. Some of the measurements, for example, oxygen concentration, have to be done from special samples made after crystal is grown from thick samples. Many measurements destroy the wafer, increasing the cost of manufacturing—these kind of measurements, if possible, are made at the minimum necessary level. In the following, a brief description of each measurement is given. A list of selected SEMI specifications and standards of commonly used measurements is given in Section 5.4. For a complete list of measurements, the reader should consult ...