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Handbook of Silicon Based MEMS Materials and Technologies by Teruaki Motooka, Ari Lehto, Markku Tilli, Veikko Lindroos

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Chapter Sixteen. Silicon Wafer and Thin Film Measurements

16.1. Important Measurements

In silicon MEMS the silicon wafer provides both the substrate and the material for the active device layer. Additionally, polished silicon wafers are often bonded on the processed wafers to form hermetically enclosed packages. Mainly three types of wafers are used: polished bulk, epitaxial, and silicon-on-insulator (SOI) wafers. If device processing is performed from the top side only, single-side polished wafers are sufficient. It is quite common, though, to process the wafer from both sides; in these cases double-side polished (DSP) wafers are used.

Polished bulk wafers are essentially uniform throughout, and membrane or cantilever structures are processed ...

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