18.1. Introduction
Residual stress characterization in microelectromechanical systems (MEMS) structures is of inherent importance in various respects. First, from the device perspective, the existence of residual stresses essentially changes the performance and reduces the structural integrity and longevity of MEMS devices. Second, MEMS techniques actually provide a new tool for studying the mechanical properties of materials such as modulus, hardness, and state of stresses. As a result, in recent years there has been rapid growth in the field of MEMS residual stress characterization. Readers are encouraged to refer to the many excellent books or papers to gain the fundamental knowledge on MEMS design and fabrication [1–5].
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