Chapter Nineteen. Strength of Bonded Interfaces
Integrated circuit technology and its later development, microsystem technology, make good use of wafer bonding. The bond strength is considered one of the most important characteristics to determine about a bond. Bond strength measurements contribute to the understanding of chemical reactions behind the bonding process, bonding optimization, and quality assurance.
In many cases, the survival of the wafer bond in later processing steps, or the performance of the ready-made component, proves that the bond is good enough. In other cases, it must be determined whether rough estimates will suffice or if more reliable data are desired. The intended use should determine the choice of method.
In this ...