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Handbook of Silicon Based MEMS Materials and Technologies by Teruaki Motooka, Ari Lehto, Markku Tilli, Veikko Lindroos

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Chapter Thirty Four. Metallic Alloy Seal Bonding

34.1. Motivation

Metallic alloy bonding uses an intermediate metal layer to solidly join two or more stacked components. The metal seal ring must primarily effect a high mechanical bond strength and a low gas or liquid media permeation. In addition, low-stress impact from the intermediate metallic layer is desired to avoid strained devices. The technology of metal seal bonding includes solder and eutectic bonding, thermo-compression bonding, solid diffusion bonding, and active metal bonding. A major driving force for the introduction of metallic alloy bonding for MEMS processing was the advantage of low processing temperature, below 450°C, such that common IC metals e.g. aluminum could withstand ...

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