References
1. A. Partridge, M. Lutz, B. Kim, M. Hopcroft, R.N. Candler, T.W. Kenny, et al., MEMS resonators: getting the packaging right, in: SEMICON-Japan, 2005.
2. Guckel H., Burns D.W., Planar processed polysilicon sealed cavities for pressure transducer arrays Proc. Int. Electron Devices Meeting 1984, 223-225
3. Ikeda K., Kuwayama H., Kobayashi T., Watanabe T., Nishikawa T., Yoshida T., ...Three-dimensional micromachining of silicon pressure sensor integrating resonant strain gauge on diaphragm Sens. Actuators A A21–A23 1990, 1007-1010
4. Ikeda K., Kuwayama H., Kobayashi T., Watanabe T., Nishikawa T., Yoshida T., ...Silicon pressure sensor integrates resonant strain gauge on diaphragm Sens. Actuators A A21–A23 1990, 146-150 ...
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