Handbook of Silicon Based MEMS Materials and Technologies

39.1. Overview of TSV Technologies

The main obstacles for commercial implementation of MEMS devices are often related to packaging and interconnection problems because many applications need full hermetic cavity through the use of getters and specialized bonding technologies. Silicon wafer with insulated electrical vias can be used as an interposer between MEMS and ASIC chip providing a route to true wafer level packaging concept. The benefits of such silicon interposer include good thermal match between the chips and the interposer and furthermore, the possibility of integrate passive devices, cavities and micro-cooling channels into the via wafer. Via wafers can also be used for the wafer level packaging or encapsulation of MEMS devices by ...