39.1.4. Laser Ablation of Via Holes
TSV process begins conventionally with the machining of the via or hole into the silicon using deep silicon etching (DRIE). The details of DRIE etching of silicon are given in the other chapters of this book. The other common way to drill via holes or blind vias into silicon is laser drilling that is also known as laser ablation. Laser ablation is a process of removing solid material by irradiating it with a pulsed laser beam. The depth over which the laser energy is absorbed, and thus the amount of material removed by a single laser pulse, depends mainly on the optical properties of the material and the laser wavelength.
Laser ablation processes for TSVs utilize focused and pulsed UV-light to drill holes ...
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