References

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2. E. Ogawa, K.-D. Lee, V. Blaschke, P. Ho, Electromigration reliability issues in dual damascene Cu interconnections IEEE Transactions on Reliability 51 2002, 403-419

3. F. Laermer, A. Schilp, Method for anisotropic plasma etching of substrates. US patent 5,498,312 (March 12, 1996) and F. Laermer , A. Schilp, Method of anisotropically etching silicon. US Patent 5,501,893 (March 26, 1996).

4. E. Kälvesten, T. Ebefors, N. Svedin, P. Rangsten, T. Schönberg, Elektriska anslutningar i substrat/Electrical connections in substrates. Swedish Patent No. 0300784.

5. A. Lehto, Capacitive ...

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