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Handbook of Silicon Based MEMS Materials and Technologies by Teruaki Motooka, Ari Lehto, Markku Tilli, Veikko Lindroos

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References

1. P. Garrou, C. Bower, P. Ramn, Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits 1–2 2008 John Wiley and Sons, Inc.

2. E. Ogawa, K.-D. Lee, V. Blaschke, P. Ho, Electromigration reliability issues in dual damascene Cu interconnections IEEE Transactions on Reliability 51 2002, 403-419

3. F. Laermer, A. Schilp, Method for anisotropic plasma etching of substrates. US patent 5,498,312 (March 12, 1996) and F. Laermer , A. Schilp, Method of anisotropically etching silicon. US Patent 5,501,893 (March 26, 1996).

4. E. Kälvesten, T. Ebefors, N. Svedin, P. Rangsten, T. Schönberg, Elektriska anslutningar i substrat/Electrical connections in substrates. Swedish Patent No. 0300784.

5. A. Lehto, Capacitive ...

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