High-Speed Photonics Interconnects

2	Low-Loss, High-Performance Chip-to-Chip Electrical Connectivity Using Air-Clad Copper Interconnects
Rohit Sharma, Rajarshi Saha, and Paul A. Kohl

CONTENTS

2.1  Introduction

2.1.1  Air-Gap Structures for Reduction of Line Capacitance

2.1.2  Fabrication of Air-Gap Structures

2.1.3  Design Issues in Chip-to-Chip Interconnects

2.2  Performance Improvement Using Air-Clad Chip-to-Chip Interconnects

2.2.1  Basic Schematic of Air-Clad Interconnect

2.2.2  Design and Optimization of Low-Loss High-Speed Links

2.3  Fabrication of Air-Clad Copper Interconnects

2.4  Conclusion

Acknowledgments

Reference

2.1    INTRODUCTION

Modern electronic systems are composed of a dense fabric of interconnected lines that connect the electronic devices on a chip ...