Chapter 18Laser Transfer of Entire Structures and Functional Devices
Alberto Piqué, Nicholas A. Charipar, Raymond C. Y. Auyeung, Scott A. Mathews and Heungsoo Kim
Materials Science and Technology Division, Code 6360, U.S. Naval Research Laboratory, 4555 Overlook Ave. SW, Washington, DC, 20375, USA
For commercial, aerospace, and military applications, miniaturization and functionality are key factors. In all these applications, the driving force is the need to achieve higher functionality in increasingly smaller packages. As a result, traditionally packaged electronic components such as integrated circuits (ICs) and surface-mount devices (SMDs) are reaching the point where their individual packaged size is too large to achieve ...
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