Low Power Emerging Wireless Technologies

13	On-Chip Accelerometers Using Bondwire Inertial Sensing
Yu-Te Liao, William Biederman, and Brian Otis

CONTENTS

13.1  Introduction

13.2  Mechanical and Electrical Properties of a Bondwire Inertial Sensor

13.2.1  Inertial Mechanical System

13.2.2  Bondwire Materials

13.2.3  Sensitivity of a Bondwire Accelerometer

13.2.4  Cross-Axis Sensitivity

13.2.5  Bandwidth

13.2.6  Resolution and Noise Floor

13.2.7  Bondwire Inductance

13.2.8  Temperature and Fabrication Variation

13.3  Electrical Readout Interface for Bondwire Accelerometer

13.3.1  System Architecture for Bondwire Inertial Sensing

13.3.2  Electrical Noise in Readout Circuitry

13.3.3  Phase Noise

13.3.4  Allan Variance

13.3.5  Residual FM Noise

13.4  Circuit Implementation

13.5  Experimental ...